Registry
Module Specifications
Current Academic Year 2012 - 2013
Please note that this information is subject to change.
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| Description | |||||||||||||||||||||||||||||||||||||||||||||
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This module aims to provide the students with an understanding of the of the design and control of the primary families of equipment used in modern semiconductor manufacturing plants, including chemical mechanical polishing, optical lithography, implantation, thermal annealing and diffusion, metal and dielectric etch, and packaging technologies. The student will learn how to design and implement statistical and advanced process control schemes and how to specify the appropriate metrology. We will also explore fundamental facilities issues including vacuum technology, gas handling, and water and waste management. Finally, the student will learn to analyse and optimize process flow through the factory and the needs of the specific tool sets. | |||||||||||||||||||||||||||||||||||||||||||||
| Learning Outcomes | |||||||||||||||||||||||||||||||||||||||||||||
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1. Design semiconductor manufacturing process flows. 2. Analyse the performance of a tool-set and relate to productivity and yield 3. Calculate and solve for optimal manufacturing throughput. 4. Outline deficiencies in the major processing systems. 5. Explain the basic physics of vacuum technology and associated technology. 6. Specify the best practice in hazardous materials handling, as relevant to semiconductor manufacturing. 7. Develop strategies for waste and water management, as relevant to semiconductor manufacturing. | |||||||||||||||||||||||||||||||||||||||||||||
All module information is indicative and subject to change. For further information,students are advised to refer to the University's Marks and Standards and Programme Specific Regulations at: http://www.dcu.ie/registry/examinations/index.shtml |
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| Indicative Content and Learning Activities | |||||||||||||||||||||||||||||||||||||||||||||
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Semiconductor Manufacturing Machines. cleanroom requiremenrs, wafer handling, maintenance and troubleshooting techniques. Process Engineering. process flow design, throughput optimisation, integration. Yield Engineering. functional and parametric yield estimation, equipment issues. Metrology and Control. tool control and monitoring. integration with factory information systems, statistical and advanced process control. Resource Management. hazardous waste and chemicals handling, energy and water management. Core Technologies. vacuum technology, data management, device integration. | |||||||||||||||||||||||||||||||||||||||||||||
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| Indicative Reading List | |||||||||||||||||||||||||||||||||||||||||||||
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| Other Resources | |||||||||||||||||||||||||||||||||||||||||||||
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| Programme or List of Programmes | |||||||||||||||||||||||||||||||||||||||||||||
| ECSAO | Study Abroad (Engineering & Computing) | ||||||||||||||||||||||||||||||||||||||||||||
| EEPM | MEng | ||||||||||||||||||||||||||||||||||||||||||||
| MEN | MEng in Electronic Systems | ||||||||||||||||||||||||||||||||||||||||||||
| MEQ | Masters Engineering Qualifier Course | ||||||||||||||||||||||||||||||||||||||||||||
| MTC | MEng in Telecommunications Engineering | ||||||||||||||||||||||||||||||||||||||||||||
| Timetable this semester: Timetable for EE588 | |||||||||||||||||||||||||||||||||||||||||||||
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