Registry

Module Specifications

Current Academic Year 2012 - 2013
Please note that this information is subject to change.

Module Title Semiconductor Manufacturing Equipment&Systems
Module Code EE588
School School of Electronic Engineering
Online Module Resources

Module Co-ordinatorSemester 1: Stephen Daniels
Semester 2: Stephen Daniels
Autumn: Stephen Daniels
Module TeacherStephen Daniels
NFQ level 8 Credit Rating 7.5
Pre-requisite None
Co-requisite None
Compatibles None
Incompatibles None
Description
This module aims to provide the students with an understanding of the of the design and control of the primary families of equipment used in modern semiconductor manufacturing plants, including chemical mechanical polishing, optical lithography, implantation, thermal annealing and diffusion, metal and dielectric etch, and packaging technologies. The student will learn how to design and implement statistical and advanced process control schemes and how to specify the appropriate metrology. We will also explore fundamental facilities issues including vacuum technology, gas handling, and water and waste management. Finally, the student will learn to analyse and optimize process flow through the factory and the needs of the specific tool sets.

Learning Outcomes
1. Design semiconductor manufacturing process flows.
2. Analyse the performance of a tool-set and relate to productivity and yield
3. Calculate and solve for optimal manufacturing throughput.
4. Outline deficiencies in the major processing systems.
5. Explain the basic physics of vacuum technology and associated technology.
6. Specify the best practice in hazardous materials handling, as relevant to semiconductor manufacturing.
7. Develop strategies for waste and water management, as relevant to semiconductor manufacturing.



Workload Full-time hours per semester
Type Hours Description
Lecture36class learning
Assignment39State of the art review
Independent learning time112Reading, notes review
Total Workload: 187

All module information is indicative and subject to change. For further information,students are advised to refer to the University's Marks and Standards and Programme Specific Regulations at: http://www.dcu.ie/registry/examinations/index.shtml

Indicative Content and Learning Activities
Semiconductor Manufacturing Machines.
cleanroom requiremenrs, wafer handling, maintenance and troubleshooting techniques.

Process Engineering.
process flow design, throughput optimisation, integration.

Yield Engineering.
functional and parametric yield estimation, equipment issues.

Metrology and Control.
tool control and monitoring. integration with factory information systems, statistical and advanced process control.

Resource Management.
hazardous waste and chemicals handling, energy and water management.

Core Technologies.
vacuum technology, data management, device integration.

Assessment Breakdown
Continuous Assessment20% Examination Weight80%
Course Work Breakdown
TypeDescription% of totalAssessment Date
AssignmentReview of the state of the art. The student will examine the relevant literature and construct a review of the semiconductor process flow for one of a number of product types20%n/a
Reassessment Requirement
Resit arrangements are explained by the following categories;
1 = A resit is available for all components of the module
2 = No resit is available for 100% continuous assessment module
3 = No resit is available for the continuous assessment component
This module is category 1
Indicative Reading List
  • Gary S. May, Costas J. Spanos: 0, Fundamentals of semiconductor manufacturing and process control, 9780471784067
Other Resources
None
Array
Programme or List of Programmes
ECSAOStudy Abroad (Engineering & Computing)
EEPMMEng
MENMEng in Electronic Systems
MEQMasters Engineering Qualifier Course
MTCMEng in Telecommunications Engineering
Timetable this semester: Timetable for EE588
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