Registry

Module Specifications

Current Academic Year 2012 - 2013
Please note that this information is subject to change.

Module Title	Plasma Applications
Module Code	PS510
School	School of Physical Sciences
Online Module Resources
NFQ level	8	Credit Rating	10
Pre-requisite	PS509
Co-requisite	None
Compatibles	None
Incompatibles	None

Description

Provide an overview of the importance of plasma technology in the modern world. Give the students an awareness and appreciation of the ways in which applications of plasmas can enable the development of new manufacturing technologies and processes. Deal with the specific plasma surface interactions which determine the performance of processing technologies. Examine the most important surface processing applications used in high technology industries, through a detailed treatment of specific examples.

Learning Outcomes

1. Recognise and explain the economic and environmental importance of modern application.
2. Identify the technical aspects of plasma surface interactions and their impact on product quality.
3. Recognise the most important examples of plasma applications.
4. To access and evaluate scientific literature dealing with plasma applications.
5. Communicate their ideas with their colleagues.

Workload	Full-time hours per semester
*Type*	*Hours*	*Description*
Moodle discussion	25	No Description
Total Workload: 25

All module information is indicative and subject to change. For further information,students are advised to refer to the University's Marks and Standards and Programme Specific Regulations at: http://www.dcu.ie/registry/examinations/index.shtml

Indicative Content and Learning Activities

Overview of generic issues in plasma applicationsPlasma chemistry.
Basic processes, reactions, simple kinetic modelsPlasma Surface Interactions: Surface states and structure. Ion, electron and photon surface interactions. Surface chemical kinetics.Surface Processing: Activation (surface energy, wetability and adhesion). Sputtering (sputter etching, sputter deposition and reactive sputter deposition). Etching (including RIE and high density plasma etching), etching characteristics (anisotropy, residues, selectivity, uniformity, damage). Deposition of thin films, PECVD. Film properties and structure (hardness and other physical properties, amorphous films, plasma polymerisation, epitaxial growth, interface issues).Specific Examples: Detailed examples of plasma processes including the plasma surface interaction mechanisms. Examples may include fluorocarbon etching of silicon and SiO2, CH4+H2 diamond deposition, activation of polymers and plasma processing of natural and artificial fibres, deposition of biocompatible thin films, deposition of metallic coatings and alloys, and/or others..

Assessment Breakdown
Continuous Assessment	45%	Examination Weight	55%

Course Work Breakdown
Type	Description	% of total	Assessment Date
Computerised test/exam	Five bi-weekly quizzes	15%	Every Second Week
Performance evaluation	On-line discussions	10%	Every Week
Essay	One of one written assignment	20%	Week 10

Reassessment Requirement
Resit arrangements are explained by the following categories; 1 = A resit is available for all components of the module 2 = No resit is available for 100% continuous assessment module 3 = No resit is available for the continuous assessment component
This module is category 3

Indicative Reading List

Other Resources

None

Array

Programme or List of Programmes

MPV

MSc in Plasma and Vacuum Technology

SMPP

Single Module Programme (Plasma)

Timetable this semester: Timetable for PS510

Date of Last Revision

29-JAN-09